From September 2 to 4, SEMICON Taiwan 2026, Asia’s largest semiconductor exhibition, was held at the Taipei Nangang Exhibition Center in Taipei, Taiwan. The event brought together major semiconductor industry players, including global semiconductor manufacturers, outsourced semiconductor assembly and test (OSAT) companies, and substrate and packaging companies, to share the latest trends in AI semiconductor and advanced packaging technologies.

LG Chem also participated in the exhibition to showcase its competitiveness in the semiconductor material solutions and expand collaboration with global customers. The LG Chem booth welcomed a steady stream of customers and industry professionals, serving as a venue for active business discussions and exchanges.

At the exhibition, LG Chem showcased a range of semiconductor material solutions targeting the growing AI semiconductor and high-performance computing (HPC) markets. As AI semiconductors deliver higher performance and integration density continues to rise, advanced packaging technologies are becoming increasingly important. In response, LG Chem placed particular emphasis on a materials portfolio spanning the entire advanced packaging process, from package substrates to dielectric, bonding, and process materials.

As thermal management becomes increasingly important for high-performance semiconductors, LG Chem also showcased power semiconductor and thermal management solutions. Through these exhibits, the company highlighted the competitiveness of its materials in improving semiconductor performance and efficiency.

The exhibition booth was divided into two main sections: the Advanced Package Zone, which introduced materials for advanced packaging, and the Power Package Zone, which featured solutions for power semiconductors.

At the Advanced Package Zone, LG Chem showcased a variety of materials applied throughout the entire advanced packaging process, including Copper Clad Laminates (CCL), Glass Core Solutions, Build-up Films, DFSR, PID, DAF, Bonding/Debonding Solutions, and Strippers.

In addition, the Power Package Zone featured solutions essential for thermal management and high-efficiency power control, including Conductive Sintering Pastes, TIM, and Thermal Management Device Solutions.

LG Chem also hosted a touchscreen quiz event to strengthen engagement with visitors. Featuring general-knowledge questions about the semiconductor industry and related technologies, the quiz offered visitors an easy and enjoyable way to participate in the exhibition. As they worked through the questions, visitors could naturally learn about LG Chem’s semiconductor material technologies and solutions.

The exhibition offered firsthand insight into the growing importance of materials technologies that underpin package structures and processes as the AI semiconductor and advanced packaging markets expand. Many customers who visited the booth showed strong interest not only in next-generation packaging technologies but also in the material technologies that make them possible.

A dedicated consultation space on the booth’s second floor also hosted active meetings with major customers. Through in-depth discussions on material performance, potential applications, and future directions for technical collaboration, LG Chem showcased the competitiveness of its semiconductor materials and further strengthened relationships with customers.

SEMICON Taiwan 2026 provided a meaningful opportunity for LG Chem to introduce its technological capabilities and business expertise in semiconductor materials directly to global customers. Going forward, LG Chem’s Electronic Materials Business Division will continue to proactively respond to changes in the AI semiconductor, advanced packaging, and power semiconductor markets and introduce differentiated material solutions that create value for customers. We appreciate your continued interest and support as LG Chem takes on new challenges in the global semiconductor market!