Showcasing Material Solutions for the AI Semiconductor Era at SEMICON Taiwan 2026

Advancing Precision and Reliability in Semiconductor Bonding: LG Chem’s Ag/Cu Paste R&D Team

A Supporting Force Enhancing Advanced Displays and Semiconductors: LG Chem’s Stripper R&D Team

Designing the Core Layer of High-Performance Packages: LG Chem’s BUF (Build-Up Film) R&D Team

Pushing the Boundaries of Next-Generation Semiconductor Packaging: LG Chem’s PID (Photo Imageable Dielectric) R&D Team

The Hidden Enabler of Advanced Semiconductor Packaging: LG Chem’s DAF(Die Attach Film) R&D Team